Next generation electronic devices require intelligent thermal management strategies in order to remove high density heat fluxes from the active electronic components. The thermal challenge grows with advancing levels of integration. Jointing more and more functionality into ever-decreasing space increases the thermal budget, i.e. the heat flux densities. Especially optoelectronic devices demand a very precise thermal stabilization in order to produce a precisely defined wavelength. Hence, hardware solutions for a smart and efficient thermal management are sought for. Micro-scale thermoelectric coolers (TEC) are therefore developed as one part of the thermal management that becomes increasingly important. To fabricate these micro-scale TECs, tellurium-based compound semiconductors with high thermoelectric performance at room temperature are deposited by electrochemical deposition, combined with structuring by laser-lithography. Within this paper, we will present the fabrication technology of the developed micro-scale TECs. Cooling performance, stability upon temperature cycling, and reliability of these micro-scale TECs were characterized by a thermal imaging method based on reflectometry. This is combined by a thermoelectric and structural characterization of the deposited thick film materials.

Integrated micro-thermoelectric coolers by template assisted electrochemical deposition

256th National Meeting (2018)

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