Chemical mechanical polishing (CMP) process is an important planarization technique in semiconductor industry, while the use of a large quantity of ultra-pure water is usually unavoidable for the process, becoming an issue for water resource conservation. Electrocoagulation has been proposed as one of the most effective CMP wastewater treatment methods in terms of particle removal capability and water reclamation. In this study, we focus on the kinetics during CMP wastewater treatment using electrocoagulation and discuss the important factors that dominate the particle removal efficiency. Several factors, including pH, aeration, current density and treating time were found to have a significant influence on the particle removal efficiency. A high particle removal efficiency of 99% can be reached by optimizing those factors mentioned above. In order to elucidate the destabilization mechanism during the wastewater treatment, a kinetic reaction model considering charge neutralization and particle coagulation was also proposed. Based on the experimental and calculated results, it has been found that they are consistent with the model.<br/>

Electrocoagulation for the wastewater treatment of chemical mechanical polishing: Kinetic study of particle removal

2019 Fall National Meeting

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