A method of toughening amine-cured epoxy systems under high rate impact loading was proposed and the resulting epoxy systems were characterized. Accordingly, a thermal reversible Diels-Alder Substructures (DAS) resin was formed by reacting a furan based diaepoxy and bismaleimides to form the Diels-Alder linkages, then the resins were added to a mixture of tetraglycidyl ether of diaminodiphenylmethane (TGDDM) and Jeffamine D230 and the mixtures were cured. The retro Diels-Alder onset temperature of the DAS was evaluated by the DSC and found to be 56°C. Quasi-static compression tests were performed on the blank (no DAS) control system and the DAS modified system at different temperatures. At room temperature, the DAS modified system shows similar mechanical behavior (Young’s modulus and yielding stress) to the blank system. However, at high temperature (&gt;80°C), above the retro Diels-Alder onset temperature, the DAS modified systems possess greater failure strain (9% more true strain) and 20 MPa higher true failure stress. Presumably thermally activated breakage of the Diels-Alder linkages in the DAS promotes the development of protovoids and enhanced plastic void growth leading to the higher ability for deformation.  Stress relaxation experiments are being conducted to probe the extent to which time-temperature superposition behavior deviates from the norm as a result of localized bond cleavage by the retro Diels-Alder reaction. <br/>

Thermal response epoxy under high rate impact loading via incorporation of Diels-Alder substructures

Macromolecular Chemistry: The Second Century

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ACS Spring 2020 National Meeting & Expo

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.