With additive manufacturing becoming more and more prevalent in almost every industry from defense, electronics, automotive, aerospace, and even consumer products, being able to tailor the materials used becomes increasingly valuable. Metal nanoparticle inks are an ideal material for printing 3D architectures in next generation electronics. Being able to exploit the semimetal or semiconducting abilities of metal nanoparticles based on size and/or shape allows for more efficiency in production and cost. Numerous synthetic routes to Cu0 and Bi0 nanoparticles have been published; however, many of those routes involve toxic reagents and commercially available precursors that are difficult to decompose into tailored bismuth and copper nanoparticles. With this in mind, Bi0 and Cu0 nanoparticles have been synthesized at high, low, and “no” temperature conditions under solution precipitation (SPPT) and solvothermal routes (SOLVO) using a wide variety of commercially available and synthesized precursors. For copper we have focused on [Cu(Mes)] due to our previous work. For bismuth we evaluated bismuth chlorides, alkyls, amides, alkoxides, and alkyl halides by altering synthetic variables such as time, temperature, and/or surfactant/solvent. In this work, the lower temperature and variety of precursors allow for large scale nanoparticle production. The final products were characterized by powder X-ray diffraction (PXRD), transmission electron microscopy (TEM), dynamic light scattering (DLS), and thermal analysis (TGA).

Copper and bismuth nanoparticles for additive manufacturing

Macromolecular Chemistry: The Second Century

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ACS Spring 2020 National Meeting & Expo

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.