Nanoparticles of silver, gold, etc have been used as nano-inks for a broad range ofapplications including flexible electronics. However, the cost for such precious metal-based materials is still very high. In this study, we propose to use cost-effective, low melting-point soldering nanoparticles (tin, indium, and corresponding alloys) as nano-ink and nano-soldering materials. We describe a simple strategy to synthesize these lead-free soldering nanomaterials using chemical reduction method in the presence of surfactant. Those lead-free solder nanoparticles were characterized by SEM, TEM, DSC, and XRD. Thermal reflow properties of these nanosolder particles were studied, and it was found that the reflow environment is crucial for the complete solder reflow to ensure wetting an  forming good contact with substrate. The advantages of using these nano-soldering materials for nano-ink applications include low-melting point, cost-effective, environmentally-benign, and potential melting point depression and thus correspondingly lower processing temperatures for electronics assembly and packaging.

Synthesis of lead-free solder nanoparticles and their application as nano-inks and nano-pastes

240th National Meeting (2010)

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