Conductive materials are extensively researching for electronic industry these days. In order to prepare conductive patterns with improving cost ratio and performance characteristic, a conductive copper ink as an alternate substance is thus, configured. For example, metal nanoparticles such as Ag, and Cu have been studied as promising functional materials for conductive inks, since they exhibit high conductivity (~105 S/cm) and operational stability as well as low temperature processability.1 We have been carried out the Cu/Ag ligation with N-methyldiethanol amine, N-triethanol amine, 3-[Bis-(2-carboxy-ethyl)-amino]-propionic acid, terephthalic acid, and glutaric acid by thermal heat and ultrasonic method to obtain the paste or ink composed of copper/silver metal.2 Moreover, the new copper complexes supported by thiophene and its derivative was further synthesized to give a inorganic polymeric structure.References:[1] X. Han, X.Wei, X.Wang, Y.Wei, Synthesis and Reactivity in Inorganic, Metal-Organic, and Nano-Metal Chemistry. 2010, 40, 563[2] S. Jeong, H.C. Song, W. W. Lee, S. S. Lee, Y. Choi, W. Son, E. D. Kim, C. H. Paik, S. H. Oh, B.H. Ryu, Langmuir. 2011, 27, 3144

Preparation of conductive metal complexes and their usage as paste or ink

242nd National Meeting (2011)

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