The broad goal of our study is to understand the mechanism(s) by which copper alloy surfaces kill microorganisms. Our results indicate that copper surface mediated cell death of E. coli correlates with increased levels of lipid peroxidation at the plasma membrane. We also determined the relationship between membrane lipid peroxidation levels and cell death in Escherichia coli on both copper and steel surfaces. Quantitative dilutions series were performed to test for bacterial cell death. Our results indicate a biphasic killing curve when E.coli is exposed to copper chips however this was not seen on steel chips. TBARS assay was used to measure the lipid peroxidation levels. Genetically altered bacterial strains show that when exposed to copper surfaces, increased levels of unsaturated fatty acids in the plasma membrane results in faster cell death rates in E.coli.  Genomic DNA analysis show a necrotic cell death pattern.

Impact of plasma membrane unsaturated fatty acid levels on copper surface mediated cell death in <i>E. coli</i>

244th National Meeting (2012)

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Impact of plasma membrane unsaturated fatty acid levels on copper surface mediated cell death in E. coli