Semiconductor device fabrication is a process used to create integrated circuits present in electronic devices. The real workhorses behind the burgeoning integrated circuit development are materials known as photoresists. Photoresists are light sensitive polymeric materials that are used to build complex structures that make up transistors and conductors that connect the millions of transistors in a circuit. Using optical lithography, a pattern of micron or submicron level is transferred onto the photoresist material coated on a wafer (silicon substrate) through a mask designed to allow light to fall on such regions of the material. A change in chemistry occurs on the exposed region and a subsequent series of treatments allows the transfer of the pattern from the photoresist onto the wafer. Photoresist have been used to manufacture many types of devices including microprocessors, flash memory, DRAM, flat panel display, light emitting diodes amongst others. Over the past decade, demand has grown for cheaper, faster, lighter and smaller electronic devices i.e., faster processing speeds, memory capacity. This in turn creates a need for innovation of materials that fit the criteria and also the evolution of optical lithographic technologies. Herein, we describe our efforts towards development of advanced photoresist materials and their ancillaries bottom antireflective coatings (BARC's) to meet the growing industrial demands.

Development of materials for semiconductor device fabrication

246th National Meeting (2013)

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