The current Sn-Ag-Cu (SAC) lead-free solders used in consumer electronics require higher processing temperatures than traditional Pb-Sn solders. Along with a higher processing temperature, the SAC system exhibits anisotropic solidification and thermal expansion and mechanical response that result in a decrease in mechanical and thermal stability. Developed in collaboration with electronics industry partners, the low temperature sintering of copper-silver core-shell nanoparticles is a promising alternative interconnect technology for lead-free electronic assemblies both at the component and the board levels. The environmental impact of the unit processes for interconnect formation using prototype copper-silver core-shell nanoparticle systems is evaluated and compared with conventional reflow soldering using a Unit Process Life Cycle Inventory (UPLCI) approach for both processes with emphasis on energy consumption.

Unit process life cycle inventory: Comparisons of a new core-shell Cu-Ag nanoparticle interconnect technology with reflow soldering

246th National Meeting (2013)

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