Polymers as future materials for high energy density capacitors need to fit many criteria, namely relatively high band gap, high dielectric constant, and low dissipation factor over a broad temperature range, as well as high demands in processability.  In the area of high temperature materials, we have systematically explored a new class of polyimides, as well as a class of organometallic polymers, having high thermal stabilities, as well as exbihiting dielectric constants in excess of 7, with loss under 1% over a broad frequency up to temperatures of 100 degrees C  The organometallic class of polymer is especially interesting since different complex formation and hence crystals result in the films wherein crystal preference is brought about by casting solvent.  The experimental data is compared to DFT data for the x-ray diffraction and infrared spectroscopy.Figure 1:  Dielectric constant for several different polymer imides as a function of frequency at room temperature.  The highest k achieved is approximately 8, based upon a polymer using Jeffamine HK511 and Benzophenone-3,3':4,4'-tetracarboxylic dianhydride (BTDA)

Rational design of polymers for high energy density capacitors

247th National Meeting (2014)

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