Our group explores thiol-ene / acrylate thermoset polymers for desired thermomechanical properties (especially shape change / shape memory and modulus change at certain conditions) for application in neural interface devices and flexible electronics [Ware et al., Polymer Reviews 53, p.108 (2013)]. During the fabrication process of such devices, thin films need to be created from the liquid monomer mixture before curing. Here, we present our investigations of the spin coating of SMP-6, a shape memory polymer, that is created by mixing a tri-ene (TATATO), an acrylate (TCMDA), a tri-thiol (TMICN), and a photo initiator (DMPA), then curing the mixture under UV irradiation for 1 hour at 365nanometer, and then post curing for 24 hrs at 120 °C. The SMP-6 monomer mixture is a relatively viscous fluid (approximately 900 cP) that thins relatively slowly (several minutes) during the spin coating process, and this allows for the coating of a relatively wide selection of thicknesses (2 to 80 µm). Figure 1 a) and b) shows the spin curves recorded using various spin times (residence times). Average film thickness and the variation across samples were measured after curing using a stylus profiler tip scanned relative to the original substrate surface at severed sections. Thickness variation was found to be below 0.5 micrometer for 4 and 6 min spin times, but up to 5 micrometer for 0.5 min spin time. Thickness variations can also be observed and monitored through visual inspection, as seen in the photographs of Figure 1 c and d. Other film defects include particles and their comets, and bubbles. In order to reduce thickness variations and to be able to filter the monomer mixture from particles, dilution with solvents was investigated. We present preliminary results from acetone-diluted samples.

Investigation of spin coating a thiol-ene/acrylate shape memory polymer for application in thin film flexible devices<br />
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249th National Meeting (2015)

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Investigation of spin coating a thiol-ene/acrylate shape memory polymer for application in thin film flexible devices<br /> <br />