Henkel Electronic Materials is a global leading provider of qualified materials and adhesives for the electronics industry. One important class of adhesives in the industry is capillary-flow underfills for solder joint encapsulation. An underfill typically must be thermally and mechanically robust, humidity resistant, electrically inert, and possess strong substrate adhesion to meet the reliability requirements. However, in addition to being a strong glue, the underfill must also be easily removable to meet rework-ability requirements to recover manufacturing cost. These opposing forces between reliability and rework-ability invite innovative chemical solutions for the product chemist to find the appropriate balance. Thermally-triggered Diels-Alder adducts composed of dicyclopentdiene and alpha-alkoxy ester moieties have been incorporated as one balanced solution. The application and performance of developed underfills will be discussed.

iPhone glues: An introduction to the chemistry of reliable and reworkable capillary-flow underfills

249th National Meeting (2015)

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