Soft-materials, e.g., polydimethylsiloxane (PDMS), are widely utilized in conventional soft lithography for feature patterning and material transferring over a large area. Lateral diffusion, however, restricts the feature resolution that can be achieved through stamping related techniques. Chemical lift-off lithography (CLL), on the other hand, can selectively remove alkanethiol molecules from self-assembled monolayers (SAMs) on gold surfaces with high pattern fidelity through a “subtractive” stamping process. The collapsing phenomenon of soft-material mold is combined with the CLL process in this research. The intentionally induced mold collapsing process creates much smaller final features than those carried by the original molds. In addition, the unique patterns fabricated through this strategy can be applied to the creation of various bio-recognition arrays for related sensing applications.

Chemical lift-off lithography by collapsing soft-material molds

249th National Meeting (2015)

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