Electroless deposition of Co-P-Mo alloys on Si wafer coated with Cu layer and stainless steel, using sodium hypophosphite as reducing agent, has been investigated. The composition of plating bath consists of 0.09 M CoSO4, 0-0.6 mM Na2MoO4, 0.24 M NaH2PO2, 0.4 M Na3C6H5O7 and 0.5 M H3BO3. The bath operated at pH 9 and 90 oC, plating time being 10 min. The morphology, structure and composition of the Co-P-Mo alloys were characterized by means of Field Emission Scanning Electron Microscopy, Energy Dispersive X-ray Analysis and Inductively Coupled Optical Plasma Emission Spectroscopy. Data on influence of sodium molybdate concentration on composition of Co-P-Mo alloy and deposition rate is presented. It was found that the obtained Co-P-Mo coatings deposited on the steel substrate are well-adherent and have a smooth structure. The electroless deposition rate of Co-P-Mo alloys is ca. 1.8 µm/h. Acknowledgement The work was carried out within the project VP1-3.1-ŠMM-08-K-01-009 that is partly supported by the National Programme “An improvement of the skills of researchers” launched by the Lithuanian Ministry of Education and Science.

Electroless deposition of Co-P-Mo alloys

249th National Meeting (2015)

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.