The highly specific, designable self-assembling nature of DNA origami has prompted exploration of applications in electronic nanosystems. However, the relative fragility of the DNA biomolecule calls into question whether DNA nanostructures are compatible with current nanoelectronic and lithographic techniques using high temperatures and harsh solvents. We explored the stability of DNA origami adhered to both mica and functionalized silicon substrates at high temperatures and after treatment with solvents commonly used in nanofabrication processes. Using atomic force microscopy (AFM), it was found that the dimensions of DNA origami adhered to a substrate were retained when heated to 150°C as well as after treatments with acetone, methylene chloride, and other solvents. Even after much longer exposure times, the DNA origami retained their shape. The chemical characteristics of the structures at higher temperatures were monitored using x-ray photoelectron spectroscopy (XPS), indicating possible chemical degradation at temperatures above 200°C. These results indicate that DNA origami, when adhered to a substrate, attains a much higher stability than is seen in solution and can withstand temperatures and solvents used in nanofabrication. This expands the possible application of DNA origami in nanoelectronics.

Substrate mediated stability of DNA origami at elevated temperatures and in diverse solvent environments

249th National Meeting (2015)

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