Flexible and stretchable electronics have great potential to revolutionize the electronic device industry. The potential benefits include lighter weight, conformal integration, and higher mechanical resiliency among others. Generally, Polydimethylsiloxane (PDMS) is used as substrate because of its flexible and stretchable characteristics. However, integrated electronic circuits on PDMS are often damaged under stretched conditions. Polyimides have demonstrated better compatibility for the integration of electronic circuits; however they lack the stretching properties observed in PDMS. Therefore, polyimides are typically deposited on PDMS at the locations where the circuit elements will be integrated. The interface between the polyimide and PDMS at these locations determines the final stretching behavior of electronic device. Detailed experimental investigations of these interfaces, especially at the molecular level, are difficult because of the complexity of the interfacial morphology. In our work, molecular dynamics simulations are currently being used to understand the interface between PDMS and an industrial thermoplastic polyimide, ULTEM (SABIC Innovative Plastics). The insights from these interfacial studies will be very useful in understanding the adhesion behavior of different side chains and backbone atoms of the polymers because the adhesion properties of various moieties will dictate the stretching behavior of overall composite polymeric system. This understanding will provide an opportunity to design novel polyimides for tailored adhesive properties with the PDMS, eventually assisting experimentalists to design highly flexible and stretchable electronic devices.

Molecular dynamics simulations of interfacial interactions between elastomers and polyimides in flexible and stretchable electronic devices

251st National Meeting (2016)

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