Epoxy based dielectrics are of great interest to the electronics and semiconductor industries. Adding nano-sized fillers to epoxy dielectrics has proven to be an effective method for improving the breakdown strength. The large surface area to volume ratio of the filler can be detrimental to the composite as it can cause agglomeration. This obstacle is overcome by adding polymer chains to the surface of the filler. Reversible addition fragmentation chain transfer or RAFT polymerization is used as a means to attach polymer chains to the filler surface as well as control polymer weight and graft densities. These two parameters are important for controlling the extent of filler dispersion. Previous work has shown that modifying the interface of the composite with conjugated, polarizable surface ligands that act as electron traps is an effective means to improve the dielectric breakdown strength of epoxy nanocomposites. Current work explores new ligand chemistries at the interface as well as the effects of filler dispersion on dielectric breakdown strength. Our studies have shown that well dispersed surface modified silica nanoparticles can increase AC dielectric breakdown strength by as much as 44% with only 2% loading in epoxy based systems.

Enhanced dielectric breakdown strength in epoxy based nanodielectrics

251st National Meeting (2016)

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