Polydopamine (pDA) is an effective binding mechanism allowing deposition of metal films on to classically inert polymer substrates. However, devices suitable for electronics, biomedical, water treatment, and energy applications have been slow to emerge, in part because the mechanical properties are often poor, inherently dependent on the bond strength of the pDA-substrate interface. pDA is known to form stable bonds with organic species terminated by specific functional groups. This property suggests that wear-resistance of pDA-functionalized devices can be improved by selecting substrates which exhibit stable bonding with pDA. To date, metal-coated pDA systems remain mechanically and tribologically uncharacterized on a substrate-dependent basis.<br/>The purpose of this study was to characterize the mechanical and tribological properties of thin metal films bound to a variety of pDA-functionalized polymer substrates. Several commercial polymer substrates were selected on the basis of their surface chemistry. Metallized polymers were fabricated by electroless deposition of copper on pDA-coated substrates. Mechanical and tribological properties of the systems were evaluated by tensile and scratch tests, respectively. Metal coatings were inspected by laser scanning microscopy to characterize wear and failure mechanisms. Robust metal coatings were capable of high strain, thought to be directly related to the inhomogeneous structure. The study suggests that wear properties of pDA-functionalized devices can be improved by appropriate selection of substrate materials exhibiting surface chemistry favorable to stable bonding of pDA.

Mechanical characterization of copper thin films on polydopamine-functionalized polymer substrates

251st National Meeting (2016)

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.