A challenging application space exists for high-aspect-ratio, high-fidelity dielectrics in micro-electro-mechanical system (MEMS), microelectronic and photonic applications.  Photosensitive polynorbornene (PNB)-based dielectrics have been shown to have high sensitivity, excellent photodefinition properties, and high mechanical strength making them suitable for MEMS, microelectronic packaging, and photonic applications. The collaborative work between Prof. Paul Kohl and Ed Elce was focused on the epoxy-based cross-linking of ultraviolet and electron beam sensitive PNB-based polymers. In this work, the impact of multifunctional epoxy-based additives on the crosslinking, photolithographic properties, and adhesion properties of the (PNB)-based dielectric was investigated. This collaborative work resulted in development of a novel high-contrast, high-aspect-ratio photosensitive polymer with improved mechanical properties and easy processing suitable for MEMS, microelectronic and photonic applications.  <br/>

Epoxy-based polynorbornenes for MEMS, microelectronics, and photonics

253rd National Meeting (2017)

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.