Polymer based dielectrics and fabrication materials are critical to the electronics industry. The advancement in electronic devices has created new opportunities for advanced polymer materials for on-chip and in-package applications. Polynorbornene and other polymers have physical attributes which make them attractive for use in electronic devices. In this talk, the synthesis, properties, and use of advanced polymers for microelectronics will be presented. Of particular interest is the development of photosensitive dielectric resins which meet customer requirements for low cure temperature, low residual stress and low dielectric constant which meet the needs of emerging advanced packaging applications.

Polymer dielectrics for electronic devices and packaging

253rd National Meeting (2017)

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