Faster CMOS electronics can be achieved by mitigating the unacceptable large chip areas required to steer heat away from or, more recently, towards the critical nodes of state-of-the-art devices. Heat guiding (HG) structures can efficiently direct heat by “meta-materials” engineering; however, some key aspects of the behavior of these systems are not fully understood. We here demonstrate control of the thermal-diffusion properties of HG structures by using nanometre-scale, CMOS-integrable, graphene-on-silica (GOS) composite materials through finite-element methods (FEM) simulations. Possible novel, controllable, <i>thermally-based</i> Boolean logic and spike-timing-dependent plasticity (STDP) operations for advanced (neuromorphic) computing applications using such thermal-guide structures have been shown.

Graphene-On-Silica, CMOS-integrable, thermal-guiding structures: Applications in Boolean-Logic and neuromorphic computation

253rd National Meeting (2017)

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