Thin films, coatings, and nanostructured materials have found extensive applications in essentially all technological and scientific areas. Tremendous advances have been made in synthesizing and processing materials with controlled structures at different length scales and desired physical properties using either physical- or chemical-vapor deposition techniques. However, one of the challenges in solution-based processes of complex materials has been the growth of high quality films with desired functionalities. In this talk, I will discuss a polymer-assisted deposition (PAD) technique, an alternative approach to chemical solution deposition, to address this challenge. This technique can be used to deposit a wide range of high performance electronic materials for diverse applications. Different from other conventional solution-based deposition techniques, PAD uses water-soluble polymers to prevent metal ions from unwanted chemical reactions and to keep the precursor solution stable. The unique chemistry and processing design of PAD deliver stable and homogeneous solutions at a molecular level to allow the growth of high quality films. Using metal-oxides, metal-nitrides, and metal-carbides as model systems, I will explain the process, microstructures, and physical properties of these materials grown by PAD.

Polymer-assisted deposition: A simple process for a wider range of electronic materials

253rd National Meeting (2017)

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