The introduction of the first commercial benzocyclobutene-based polymer in the early 1990’s revolutionized the microelectronics packaging and interconnect industry by providing a low dielectric constant, low moisture uptake material with no volatile generation. An equally large effect on the industry was achieved with the invention of photocurable benzocyclobutene technology, which enabled even faster and lower cost device processing, and facilitated a broad range of new device schemes and fabrication processes. Today benzocyclobutene (CYCLOTENE™) resins are the dielectric of choice in many applications, with significant market share in the wafer-level packaging market, and present in a large number of mobile devices.<br/>The successful development and commercialization of these high-performance photodefinable polymers required significant technical advances on multiple fronts, from the invention of cost-effective scale-up chemistry, to developing a fundamental understanding of the curing mechanism crucial to achieve optimal polymer network formation, invention of a robust photocrosslinking system, as well as the development of new analytical metrology to accelerate adoption by customers. In this address, we will discuss how several of the key technical challenges associated with developing and commercializing this enabling dielectric material were overcome, and look at future challenges and directions for dielectric materials.

<b>Award Address </b>(ACS Award for Team Innovation sponsored by ACS Corporation Associates). Development of photodefinable benzocyclobutene dielectric polymers: An enabling material for integrated circuit packaging

253rd National Meeting (2017)

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Award Address (ACS Award for Team Innovation sponsored by ACS Corporation Associates). Development of photodefinable benzocyclobutene dielectric polymers: An enabling material for integrated circuit packaging