Most adhesives used industrially are neoprene based, and contain organic solvents such as toluene. These solvents are volatile, and are deleterious to health and the environment. The Michael addition of telechelic oligomers provides a solvent-free pathway to create new network based adhesives. Two facile reactions of a telechelic diol allowed for the successful synthesis of a Michael donor and Michael acceptor with identical oligomeric backbones. Rheology revealed that the crosslinking kinetics increased significantly with increasing temperature and wt% of catalyst. In situ FTIR monitored the disappearance of the Michael acceptor during the reaction, and confirmed the kinetics shown in rheology. A 90° and 180° peel test was employed to determine the maximum load of the adhesive applied to three types of industrial rubber. The oligomer based networks showed maximum loads which were comparable or greater than solvent-based neoprene adhesives. Solvent-free adhesive networks were successfully synthesized from telechelic oligomers via the Michael addition reaction.

Michael addition as a means to design solvent-free adhesives: Networks based on reactive telechelic oligomers

254th National Meeting (2017)

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