We have combined a maskless patterning technique, direct laser writing (DLW), and conventional mask-based lithography to take advantage of their benefits while minimizing the shortcomings of each. Namely, masks tend to be expensive and unalterable but enable rapid patterning over large areas, while maskless techniques tend to be slow to pattern large areas but are adept at high resolution rapid prototyping. Using commercially available photoresists, both positive (S1813) and negative (SU-8), we have patterned large features with a mask and then appended smaller features to the overall pattern using DLW. This new process allows for efficient and inexpensive rapid prototyping of micro-devices such as circuits and microfluidic devices.

Hybrid lithography: Combining masked and maskless lithography

254th National Meeting (2017)

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