Printed wearable electronics routinely involve bending, twisting and stretching of the ultra-thin organic film during the roll-to-roll manufacture and under use. To date, the most widely adopted method to measure the mechanical property of thin film relies on a buckling metrology developed by Stafford et al. The Young’s modulus is simply linked to the wrinkling phenomenon of the polymeric thin film on elastomer substrate under compression. In this talk, we will discuss an alternative route to use a pseudo-free standing tensile tester to directly measure the full stress-strain curve for an ultra-thin film ( i.e., film thickness less than 50nm). At this length scale ( i.e., &lt; 50nm ), the mechanical property of the thin polymeric film is known to deviate from its bulky due to the free polymer/air interface or polymer/substrate interaction. This study is aiming to provide a direct insight into the mechanical property for flexible electronics at the nanoscale.

Directly measuring the complete stress−strain response of ultrathin organic electronic films

255th National Meeting (2018)

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