In printed electronics technologies, the precision of printed patterns is a critical issue when applying printing technology to electrical device manufacturing. Among many printing technologies, reverse offset printing has the advantage of fine patterns. In addition to enabling fine patterning on the scale of less than a few micrometers, the method ensures the preservation of high-quality surfaces, which are essential for multi-layer devices. Recently, silver nanoparticle ink was developed for reverse offset printing process consisted of coating process, off process and set process. Each process inquires proper ink characteristics including surface tension, viscosity, and adhesion with cliché and substrate. These properties are a crucial factor in fine pattern quality. In this works, silver nanoparticles with a uniform diameter of 30-50 nm were synthesized using the polyol method. Silver nanoparticles were dispersed using ethanol as a solvent. By using various additives, excellent long-term dispersion stability and coating property were obtained. Further, a solvent having another boiling point was further added to improve transferability. The characteristics of the fine pattern using reverse offset printing were confirmed by electron microscope and optical microscope, and fine patterning of less than 10 μm was confirmed. As a result, we demonstrated that silver nanoparticle ink can be successfully applied to the reverse offset process, and it will contribute to the mass production of various electronic devices.

Silver nanoparticle inks for fine patterns using reverse offset printing

256th National Meeting (2018)

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