We have successfully developed several ligands using picolinic amide derivatives for copper-catalyzed aryl C-C, C-O, and C-N bond formations. Now, we developed a new ligand using N-pyridyl urea motif, which can be considered a derivate of picolinic amides, for copper-catalyzed aryl C-N bond formations. The reaction requires only 5% of copper (I) oxide and 5% ligand in DMSO and can be done in 30 min under microwave irradiation at 110 <sup>o</sup>C. The reaction was successfully carried using several aryl amines, such as pyrrole, indazole, indole, and several aryl halides, such as ortho or para-substituted electron deficient or rich, as substrates providing between 75-98% yield and showed greater yield compared to our original N-picolinic amide ligands. The results of coupling reactions with different ligand derivatives will be discussed.

N-pyridyl urea derivatives as a ligand for copper-catalyzed aryl coupling reactions

256th National Meeting (2018)

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.