Environmental impact, cooling costs, and increasing power densities are motivating electronics thermal management engineers to evaluate emerging single- and two-phase immersion cooling technologies as potential competitors to traditional air-cooling strategies. However, most existing thermal management hardware was not designed for direct immersion cooling, especially the small spaces and board pitch such setups may be able to facilitate. In this work, low profile copper 1D micro-fin arrays were fabricated using a high-throughput roll-molding technique and their pool boiling performance measured within an experimental setup with a widely utilized dielectric coolant. Sample arrays were first tested in their as-rolled state, with their performance compared to planar specimens of the same material as well as previous results for aluminum alloy arrays of similar geometry. To examine what performance gains might be realized via a multiscale approach, a solution-based oxidation scheme was then employed to synthesize nanostructures on the surfaces of the copper micro-fin arrays and their pool boiling performance re-measured. In addition to performance data, high speed imaging allowed for comparison of bubble nucleation behavior, size statistics, and other observations which help explain the underlying physical processes which may differ between samples and thus guide future work in surface engineering and optimization. Numerical models, validated against experimental data, were also utilized in developing an understanding of the links between micro-fin structure and performance.


Subcooled Pool Boiling Performance of As-Rolled and Nanostructure-Modified 1d Copper Micro-Fin Arrays Fabricated by High Throughput Roll Molding

Division / Sponsors: 
Heat Transfer Division (HTD), Fluids Engineering Division (FED)

Heat Transfer Summer Conference
Paper Proceedings: https://asmedigitalcollection.asme.org/HT/HT2020/volume/83709

18th International Conference on Nanochannels, Microchannels, and Minichannels
Paper Proceedings: https://asmedigitalcollection.asme.org/ICNMM/ICNMM2020/volume/83693

Fluids Engineering Division Summer Meeting
Paper Proceedings: https://asmedigitalcollection.asme.org/FEDSM/FEDSM2020/volume/83716

HT-ICNMM2020 - Virtual Conference, SHTC - Virtual Conference, FEDSM2020 - Virtual Conference

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