In recent years, countries worldwide acknowledged the imperative to act on global warming and air pollution. As a more eco-friendly option, various transportation policies for electric scooters have been proposed to help the reduction of carbon emissions. According to the latest market report for 2019, the demand for E-scooters will continue to grow in the next decade. Furthermore, E-scooters may replace petrol and diesel motorcycle and become the mainstream in the future. Therefore, top automakers are racing to capture the growing electric scooter opportunity. However, as the increasing demand for power density and lightweight specifications, the conventional solution which employed the discrete power components (TO type package components) for E-scooters is no longer sufficient to achieve the new generation of high power drive specifications and excellent heat dissipation with the highly miniaturized system simultaneously. For these reasons, we designed and fabricated an 10KW high power density E-Scooter drive module with high performance insulated metal substrate (IMS) and this power module integrated the three-phase inverter circuit, DC bus switch hardware circuit, current sensing resistors, and thermistors. This module size is 120 mm\*95 mm\*12 mm and this module solution could significantly increase the volumetric power density at least 4 times in the field of inverter circuit comparison the conventional discrete solutions. The thermal conductivity of TIM materials is above 12 W/mk and the thickness is 120 μm. The test result of junction-to-case thermal resistance is 0.15 K/W which is better than the TO-series type package with the same MOSFET bare die. The module has achieved a high-level assembly process quality, the void rate of the solder joint was lower than 1% and the wire bonding also has a stable condition by controlling the pull strength over Cpk 1.67. The module has passed the automotive-grade reliability tests including temperature cycling test (TCT, -55℃\~150℃ for 1000 cycles), highly accelerated stress test (uHAST, 130℃/85 % RH for 96 hrs), high temperature reverse bias (HTRB, 150 ℃/80 % reverse bias of power chip maximum voltage for 1000 hrs), and intermittent operational life test (IOL, ΔT~jc~ ≧1 00 ℃, t≧15000 cycles) according to the AEC-Q101 standard and IEC 60747-15 isolation voltage test (2.5 KV/1mins-AC). The power efficiency of the innovative driving system could reach over 97 %.


Innovative High Density Power Module for E-Scooter Motor Using a High Performance Insulated Metal Substrate

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

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