The miniaturization of microelectronic devices and an increasing demand for clock speed result in high heat flux systems. By adopting direct liquid cooling, the high heat flux and high-power demands can be met, while the reliability of the electronic devices is greatly improved. In this paper, thermo-hydraulic performance of a commercial hybrid micro-channel/slot-jet heat sink with water coolant was analyzed in detail. The copper microchannel heat sink with fin height 3mm, fin thickness 0.1 mm and channel width 0.1 mm was used for removing heat flux from the chip. Liquid flow was directed to microchannel fins by multiple slot jets, alternately providing impingement flow. A three-dimensional numerical simulation using commercial software 6sigmaET is carried out and validated with results of experimental data. The effects of the operating parameters on the heat sink thermo-hydraulic performance was studied.  CFD simulation was performed at inlet temperature of 29 ^o^C, 36 ^o^C, 50 ^o^C and 60 ^o^C. Flow rate was varied from 0.7 LPM to 3 LPM. Geometry optimization was performed, considering the process of cutting the microchannel into pin fins. It was observed that the thermal resistance of pin fin heat sink was reduced by 29.4 percent as compared to original microchannel heat sink and without changing pressure drop significantly. The combination of multiple slot-jet and pin fins leads to improvement of thermal performance as compared to micro-channel/muli-jet combination.

 


Liquid Cooling Utilizing a Hybrid Micro-Channel/multi-Jet Heat Sink: A Component Level Study of Commercial Product

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

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