Flexible electronics is being emerged as a new trend in the consumer industry. Aerosol Jet printing technology is growing fast as it is a non-contact method of making interconnects. The width of the line can also vary according to the process parameters giving us the option of print the lines in microns. The research till now mostly concentrates on the single-layer printing with consideration of various parameters like humidity, temperature and strain rate. The conventional PCBs are multi-layered and for the flexible PCB to be used in real-world it is important to have multi-layer stacking of interconnects and establish z-axis connections through vias as been done in the conventional PCBs. Aerosol printing method gives us a broad aspect to establish the interconnects depending upon different inks available like silver, copper, carbon etc. In this paper, the objective is to establish z-axis interconnections with the help of Aerosol printable silver ink and dielectric polyimide ink. The silver ink would be using the ultrasonic atomizer to print, and the pneumatic atomizer would be used for the polyimide ink. The micro-vias would be printed with the help of pneumatic. The printed conductive lines would be subjected to different sintering conditions and then tested for the parameters like resistance across the interconnects and shear load to failure. Printing of multi-layer for 8 conductive layers is been studied in this paper. Sintering profile has been studied for a lower resistance and higher shear load to failure to sustain the daily motions of human body.


Development of Process-Recipe for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

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