This study focuses on the feature vector identification of SAC305 solder alloy PCB’s of two different configurations during varying conditions of temperature and vibration. The feature vectors are identified from the strain signals, that are acquired from four symmetrical locations of the PCB at regular intervals during vibration. The changes in the vibration characteristics of the PCB are characterized by three different types of experiments. First type of analysis emphases on the vibration characteristic for varying conditions of acceleration levels keeping the temperature constant during vibration. The second analysis studies the characteristics changes for varying temperature levels by keeping the acceleration levels constant. Finally, the third analysis focuses on the combined changes in temperature and acceleration levels for the board during vibration. The above analyses try to imitate the actual working conditions of an electronic board in an automobile which is subjected to varying environments of temperature and vibration. The different acceleration levels selected for this test are at 5g and 10g in vibration and the temperature conditions are for 25^o^C, 75^o^C and 125^o^C. The two test board configurations used are of JEDEC standard dimensions but differ only in the number of packages on the board. The first board has twelve packages with area array configuration arranged in a rectangular pattern and the second board has a single area array package at the center. The strain signals acquired during each of these experiments are compared based on both time and frequency domain characteristics. Different statistical and frequency based techniques were used to identify the variations in the strain signal with changes in the environment and loading conditions. The feature vectors of failure at a constant working condition and load were identified and as an extension to the previous work, the effectiveness of the feature vectors during these varying conditions of temperature and acceleration levels are investigated using the above analyses. Investigations on the success of the feature vectors with changes in the temperature and acceleration levels based on the three analyses listed above are also studied in detail. In conclusion the feature vector of a PCB under varying conditions of temperature and load are identified and compared with different operating environments.


Feature Vector Identification and Prognostics of Sac305 Pcb\u2019s for Varying Conditions of Temperature and Vibration Loads

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

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