*In the current world, demand towards Computer Applications have increased exponentially, with massive amount of data being generated on a day-to-day basis. This generates a surge in Power Density and Heat Generation, requiring an engineering solution for efficient thermal management for longer and safe working of these servers and its components in data centers. Air-Cooling is a prominent method, with its low cost and easy installation being the major advantages. However, its usage has reduced over the recent years. Due to the low heat carrying capacity of air, it is not an efficient method of data center cooling. There are two methods to remove this heat. Increasing the area of heat transfer is one of the methods, which is not feasible everywhere. To tackle this problem, liquid immersion cooling method has emerged as a prominent method. Liquid has higher thermal properties like heat capacity, but the limitation is that the liquid must be dielectric to save equipment from short-circuit.* *This feature also influences the thermal conductivity of the liquids.*

*Generally dielectric liquids have low thermal conductivity which affects the thermal performance of the cooling process. Thermal conductivity of the dielectric liquids are drastically increased with the introduction of nano particles, which has proven to be the best method. Nano particles are metal and non-metal particles with the size between 1 to 150 nanometers. To keep the dielectric feature of the liquid, the non-metallic nano particle can be added to the liquid. Therefore, the Alumina which is one of the materials used as an electrical insulation is used. The mean size of the nano particle used in this work is 80 nm and the liquid is mineral oil, which is a low-price liquid for immersion cooling compared to other dielectric liquids. The concentration of nano particles was 0 to 5 percent and it is assumed to remain homogeneous. The properties of the mixture were calculated based on the theoretical formula and it was a function of temperature. In this work, we simulated heat transfer and effect of the nanoparticle concentration on the junction temperature of the processors using CFD techniques. The chosen server is an open compute server which has two processor in a row. The junction temperature also was studied for different flow rates of 0.5, 1, 2 and 3 LPM, by varying the inlet temperature at three different values of 25, 35 and 45 degree Celsius. The simulations were performed for the three heatsink geometries as follows: Parallel plate, Pin fin and Plate fin heatsinks. Parametric trials were conducted to find out the optimum number of fins on the parallel plate heatsink.*


Numerical Analysis of Oil Immersion Cooling on a Server Using Al2o3/mineral Oil Nanofluid

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

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