**Chair**: Daniel Hines, *Laboratory for Physical Sciences, College Park, MD*

Materials for Additive/Printed Electronics are one of the â€˜hard problemsâ€™ related to achieving robust manufacturing capabilities in this area. High quality and fully characterized solutions are needed in at least 3 main categories of inks: (1) conducting inks, (2) dielectric inks and (3) structural inks (e.g., for substrates). Panelists will discuss the state of the art in materials for additive/printed electronics and will also address questions including how to set requirements/standards for these materials and how to create a robust supply chain that can service the manufacturing needs of the industry.


Materials for Additive Manufacturing

Division / Sponsors: 
Electronic & Photonic Packaging Division (EPPD)

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2020/volume/84041

InterPACK2020 - Virtual Conference

Supporting the need among researchers worldwide for additional online and multimedia content, ASME now offers the ASME Conference Video Collection. This platform will collect and provide long-term access to conference presentation videos, encompassing all technology areas within ASME's technical conference and events program. About 30,000-40,000 engineers across all mechanical engineering and related disciplines participate in ASME conferences each year. This includes authors of approximately 6,000 to 8,000 technical papers published by ASME, the majority of whom also submit video presentations for our virtual conferences. The video collection will be available as an add-on to existing product packages or as a separate subscription.