The modern world progressively demands more and more energy; according to forecasts the consumption of energy will grow at an average annual rate of 3 percent. Therefore, it is necessary to innovate, design, manufacture and buy products or devices that are efficient and environmentally friendly. Several studies show that 20% of the current energy production is consumed by the illuminating sector. Technology in LED (Light Emitting Diode) lighting is presented as an alternative to saving electrical energy, since LEDs have proven to be extremely efficient, have a long service life and their cost-effective ratio is very good. However, their main problem is the high production of heat; the heat emitted by the LED chip must be dissipated effectively, since the overheating of the chip reduces the efficiency and lifetime of the lamp. Therefore, heat sinks must be designed and built in a reliable, efficient and economical way. This work proposes new designs of passive heat sinks (low-cost cooling system) for their implementation in high-power LED lamps, its geometry consisting of a radial base and ellipsoidal fins. Variations were made in the geometric parameters (height, number of fins and the thickness of the fin), since a model is sought that offers the lowest critical temperature in relation to the lowest mass. Some of the models in the geometric fin parameters refer to the Fibonacci series. The transport equations representing the physical phenomenon (continuity, momentum and energy) are solved numerically using specialized CFD software, and the prediction of the thermal performance of the proposed schemes was obtained. The temperature difference between the environment and the heat sink base, the thermal resistance and the mass of each of the proposed heat sinks were analyzed. The models proposed in the present work that have a significant advantage are the *Type 2E*Model which has 14.7% less mass with a slight temperature increase of 2.7 K, while the *GR Type 2*Model has a saving in material of 13.55% and only an increase of temperature of 3.3 K (both compared to the model proposed by Jang et al. \[2014 b\]). The *Type LME*Model presented a material saving of 34% with a slight increase in temperature of 2.2 K compared to the model proposed by Yu et al. \[2010\]. Something to remark is that all the proposed models presented material savings, being thus lighter and more efficient compared to the small increases in temperature they experience.


Low Cost Cooling Device for High Power LED Lamps

Division / Sponsors: 
Aerospace, Bioengineering, Applied Mechanics, Design Engineering Division, Advanced Energy Systems, Manufacturing Engineering Division, Noise Control and Acoustics, Nondestructive Evaluation, Diagnosis, and Prognosis (NDPD), Nuclear Engineering Division, Process Industries Division, Fluids Engineering, Heat Transfer, Materials, Microelectromechanical Systems, Safety Engineering and Risk Analysis, Computers & Information in Engineering


Paper Proceedings: https://asmedigitalcollection.asme.org/IMECE/IMECE2020/volume/84478

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