<p>The detection and quantification of the die attach (DA) quality in a semiconductor device is an important factor to consider during mass production.&nbsp; The presence of voids and delamination in the DA layer will lead to increased junction temperatures for the device, and will ultimately negatively influence its lifetime and reliability. It will be advantageous to be able to perform Inline tests of these devices during production using a short time thermal transient test. Non-intrusive, non-destructive and quick testing of the devices to determine the presence and the coverage of voids in the DA layer will allow them be sorted accordingly. &nbsp;Structure Functions and Thermal Impedance curves are used to detect the voids. CFD simulations on a calibrated thermal model of the device were carried out prior inline tests, to quantify void percentage and thermal impedance values of the devices. These results can be used as the binning criteria during the sorting process. The simulations were also used to verify the minimum power pulse duration required for effective detection. It was found that there was a clear relationship between the void percentage and thermal impedance values.</p><p>Thermal Transient Tests to determine the thermal characteristics of a good sample of the MOSFET device will be shown initially. The measured results for two samples (good and poor DA) will be compared. Two sets of measurements will be shown, one at the normal test duration of over a minute, while the second was considerably shorter at 50ms.&nbsp; Finally, a CFD model of the same device is created and calibrated using the Structure Functions results from the experiments. Simulations with different combinations of different sized voids, locations and numbers will be demonstrated.</p>

Using Short Thermal Transient Tests to Assess the Quality of High Power Density Semiconductor Packages in Production

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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