<p>With the accelerated application of cloud computing and artificial intelligence, the computing capability and power consumption of chips have increased significantly which brings great challenges on system thermal design. In this paper, Baidu has developed and adopted a new air-cooling solution based on advanced phase change cooling technology and successfully fixed the thermal design challenge from the high heat flux density of the AI server system.&nbsp; The work mainly focuses on two aspects. First, a customized 3D vapor chamber (3DVC) heat sink is designed to replace the general heat pipe heat sink. The inner cavity of 3DVC heat sink is filled with phase-change coolant. Phase-change heat exchange can reduces the thermal resistance of the heat transfer path and improve the overall heat exchange efficiency. Secondly, an independent cooling airflow channels is optimized between the front and rear GPUs through a unique structural design to avoid the pre-heating effect of shadow GPUs. This paper describes the design, optimization, testing and verification of the 3DVC solution in details and demonstrates that this innovative solution can bring great benefits on cooling capability and system power saving. As testing data show, this solution can decrease GPU’s temperature by over five degrees and system fan’s power by over 30% compared with traditional heat pipe thermal solution.</p>

Design and Application of Innovative 3DVC in AI Server System

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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