<p>Phase change thermal management devices including heat pipes and ultra-thin vapor chambers are able to remove and spread the excess heat from microprocessors more efficiently compared with the conventional heat sinks. However, the capillary and CHF limits of the evaporator section remain a challenge for high heat flux (&gt;100 W/cm2) large area (&gt;5x5 mm2) applications. In this study, a hybrid microporous structure consists of 5-layer copper wire mesh (500&nbsp;μm&nbsp;thickness, 0.5 porosity)&nbsp;as liquid delivery routing and a thin copper inverse opals (CIOs) wick as boiling/evaporation platform is proposed. The design has been optimized using modelling and CFD simulations of graded copper inverse opals and random-packed microporous copper. In continue, the optimized structure is fabricated using electroplate-bonding of copper mesh and template-assisted electrodeposition of copper inverse opals with average 5μm pore size, 1 μm neck and 15&nbsp;μm thickness. Various porosities and permeability are achieved using different polystyrene sphere sintering conditions. Thermal performance is characterized by performing capillary-fed boiling tests in a saturated environment (water and vapor at &gt; 98 oC). Fabricated hybrid microporous structure was able to remove over 35 W from 5x5 mm2 area (over 140 W cm-2 heat flux) with 7 oC super heat resulting in thermal resistance of 0.05 cm2-oC/W at the CHF. Findings of this study are largely beneficial for design and fabrication of high performance heat pipes and ultra-thin vapor chambers.</p>

A Hybrid Microporous Copper Structure for High Performance Capillary-Driven Liquid Film Boiling

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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