<p>Flexible devices, nowadays considered to be the next wave of electronics industry. The characteristics of flexible electronics is not only reduced production cost but also thinner, lightweight and non-breakable which creates a new form application for the electronic devices. One such application is use to electronic devices in daily environment to monitor the vitals of one’s body. These devices are often expose to dust, sweat and moisture also they are generally subjected to flexing and folding motion which accrues stresses in those devices. These stresses and the harsh environment are often mitigated by using potting compounds, encapsulants to improve their survivability of the devices. In our study, we have chosen five different formulation of encapsulant subjected it various cure profiles to determine the adhesive strength of the various encapsulant. The benchmark peel strength was developed using a FE-model of the AU-biometric band and encapsulant peel strength at experimental conditions were compared to give us the best performing material. This paper includes the sample geometry which consists of five different encapsulants and two different substrate namely, polyimide and pet tested at four different cure schedule while the substrates were cleaned using two different cleaning methods and flex encapsulants are compared among each other to create a rank for FHE applications.</p>

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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