<p>The flexible sensor could be mounted on any curved surfaces of applications and be used for portable devices. Thus, recently, an additively printed sensor is focused by many researchers due to the facts that it is flexible and compact. Despite the advantages, there are few of previous research especially on reliability test of the flexible sensors, even though there are many of characterization of resistance variation to temperature test. In this regard, there is need for studies focused on the development of sensor reliability test stand for lab-test levels. In this study, experimental analysis on function of the fabricated sensing board is conducted. The temperature sensors are made by direct write printing method with NSCRYPT printer. A calibration of the sensors has been conducted to confirm that resistance is well related to actual temperature and find TCR (temperature coefficient to resistance). Consequently, temperature sensor resistance which is correlated to actual temperature have been acquired. Next, analysis on hysteresis effect of resistance versus temperature have been conducted. Accordingly, it is discovered that although hysteresis of resistance from the printed sensors exist, but it is negligible. Additionally, folding reliability test is conducted for life prediction of the sensors. Thus, we have been able to understand failure mechanism by conducting regression analysis with the experiment results. Finally, for better understanding the failure phenomenon, FEM (finite element method) analysis has been done to simulate the reliability test. In consequence, stress distribution and concentration which is caused by folding motion has been acquired, so that the results could be helpful to comprehend the characteristics of failure on the sensor.</p>

Additively Printed Flexible Temperature Sensor for Wearable Applications

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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