<p>Boiling offers an effective means of high heat flux dissipation for thermal management of electronics, power plants, and nuclear reactors. System performance and efficiencies in many of these applications are often limited by thermal management, and there is a particular need to dissipate high heat fluxes while maintaining low surface temperatures. Enhancement of pool boiling heat transfer performance using surface modifications is an active area of research, and within the last decade, studies have extensively explored the use of microstructured surfaces to enhance the critical heat flux (CHF) and heat transfer coefficient during boiling. Designing predictable thermal management systems based on boiling from such textured surfaces requires an understanding of the mechanisms of improvement for both CHF and heat transfer. While it is well-known that microstructured surfaces promote capillary wicking to enhance CHF, their role in enhancing the heat transfer coefficient is not yet clear. In the present work, micropillar arrays are fabricated with controlled geometries that highlight trends specific to evaporative performance. Pool boiling experiments on the microstructured surfaces are performed using HFE-7100, and a linear relationship between the predicted evaporation performance and measured pool boiling heat transfer coefficients is demonstrated. We thereby postulate that the enhancement of evaporative performance underneath bubbles due to microstructuring is attributed to the measured improvement in the heat transfer coefficient during boiling. Further, characterization of surfaces for evaporative performance may serve as an important proxy to enable prediction of heat transfer coefficient during pool boiling.</p>

Microlayer Evaporation Enhancement During Pool Boiling on Structured Surfaces

Paper Proceedings: https://asmedigitalcollection.asme.org/InterPACK/InterPACK2021/volume/85505

ASME 2021 International Electronic Packaging Technical Conference and Exhibition (InterPACK2021)

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