Semiconductor devices are encapculated with polymeric composites to protected integrated circuits and their input/output pins from environmental and use condition stresses. The composites are mainly composed of thermoset and silica particles. The materials have excellent electrical performance because of their construction and the purity of the thermoset resins. In this contribution different resin systems will be presented with their characterization using time and frequency domain electrical impedance measurements. The purpose of the presentation is to draw attention to the semiconductor packaging technology and how dielectric measurements can be used to improve material designs. Enclosed image shows the cross-section of a such material filled with spherical silica particles.

Dielectric relaxation in highly filled polymeric composites in semiconductor packaging

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ACS Fall 2022

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