Electrochemical metal dissolution reactions are important in many technical processes, such as corrosion, micromachining, and battery. The electrode kinetics depend sensitively on electrode surface structures, including grains of different crystal orientations, grain boundaries, and other defects. However, typical electrochemical measurements are performed on bulk electrodes containing different structures distribution, resulting in the averaged kinetics. To better understand the local surface structure and its relationship with the kinetics of metal dissolution reaction. We use Ag as a model system, focusing on studying the local kinetics of metal dissolution and its relationship with different types of grain boundaries. The local dissolution kinetics can be obtained by mapping the polycrystalline silver surface via SECCM. Colocalized local structures and grain boundary angles can be obtained by atomic force microscopy (AFM) and electron backscattering diffraction (EBSD). From this correlative multi-microscopy approach, it is shown that local dissolution correlates with the geometrically necessary dislocation density. Ag dissolution kinetics have been found relative to the relative grain boundary energy.

Mapping ag dissolution reaction at grain boundary by scanning electrochemical cell microscopy (SECCM)

Fall 2022 abstracts, posters, and presentations will launch in mid-September.

ACS Fall 2022

The official archive and repository for all ACS Meetings & Expositions abstracts and select posters or presentations.