The corrosion mechanism of Aluminum bond pads in a chloride ion environment is reported and hydrogen evolution was found for the first time as the main cathodic reaction to drive rapid Al bond pad corrosion reaction, leading to fatal defects of Cu ball lift-offs. A new packaging friendly surface treatment on Cu wire bonded devices showed excellent resistance to Cl<sup>- </sup>induced corrosion. It also proved effective in limiting corrosion of copper and aluminum alloys, which form between the copper and aluminum bond. Further investigation revealed that the outside aluminum perimeter can increase the rate of wirebond liftoff through direct contact with the wirebonds. The microchip coating process continues to be optimized to further corrosion prevention and functionality of devices.

Electrochemical investigation of Al bond pad corrosion and prevention for IC packaging application

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