A variety of questions may arise in the UV-curing process of polymeric materials. For example, when does UV-curing start? When is UV-curing complete? What is the reactivity of the resin? What is the glass transition temperature after curing? Which photo initiator does show best performance? How does mechanical property of the cured material change in UV-curing process?<br/><br/>Differential Scanning Calorimetry (DSC), Dielectric Analysis (DEA) and Dynamic Mechanical Analysis (DMA) offer effective means to answer these questions. DSC measures reaction enthalpy and degree of cure initiated by irradiation. DEA allows for the measurement of changes in the dielectric properties related with ion mobility and dipole alignment during cure. Compared with DSC, DEA is good for fast cure system because data acquisition rate is less than 5ms and more sensitive to small change in cure process when close to the end of cure. DMA measures how modulus changes during UV-curing process. These thermal analysis methods are indispensable in both R&D and quality control in the area of UV cure.

Optimizing and monitoring UV-cure process by thermal analysis (DSC, DEA and DMA)

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