Since the first biomedical use of hydrogels for contact lenses in 1960, hydrogels have been applied for various applications including drug delivery, cell culture, and diapers, among others. Recent work has enhanced the complexity and utility of these materials by incorporating conductive fillers for artificial skin, flexible and implantable bioelectronics, and tissue engineering. Over the last two decades there has been an explosion of research regarding the synthesis and application of conductive hydrogels, specifically utilizing conjugated polymers such as PEDOT:PSS, polyaniline, and polypyrrole, however, it remains a challenge to formulate conductive hydrogels with high electrical conductivity, without compromising their mechanical properties. Several methods have been reported to incorporate the conjugated polymer within the hydrogel, including in situ polymerization, encapsulation, or blending; each technique has varying effects on the macroscopic properties of the conductive hydrogel. While approximate trends can be seen in the literature, the lack of consistency in reported electrical and mechanical characterization makes it challenging to determine the relationship between the filler incorporation method, and performance. To determine this relationship, we prepared hydrogels using various synthetic (PDMS, PEGMA) and natural (gelatin, alginate) materials and impregnated each hydrogel via in situ polymerization, encapsulation, or blending. We found that the method of incorporation played a significant role in the hydrogel's final electronic and mechanical properties. Our findings outline design rules to generate both soft and conductive hydrogels for bioelectronic applications.

Method matters: Designing conductive hydrogels for bioelectronics

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